BS EN ISO 9453:2006 Soft solder alloys - Chemical compositions and forms (Withdrawn)
Publication Year
2006
Document Status
Withdrawn
Abstract
Specifies the requirements for chemical composition for several families of soft solder alloys. The families covered are: tin-lead, with and without antimony, bismuth, cadmium, copper and silver; tin-antimony; tin-bismuth; tin-copper, with and without silver; tin-indium, with and without silver and bismuth; tin-silver, with and without copper and bismuth; tin-zinc, with and without bismuth. Also includes an indication of the forms generally available.
Document History
Superseded by BS EN ISO 9453:2014. Supersedes BS EN 29453:1994.
ISBN
0580497518
Publisher Information
British Standards Institution
With over 100 years of experience the British Standards Institute is recognised as the UK’s National standards body. Their committees work with the manufacturing and service industries, government, businesses and consumers to facilitate the production of British, European and International standards.
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